Test Sockets

Gold Technologies, Inc. (Goldtec) design and manufacture pogo pin Test & Burn-in sockets and Strip contactors. See details below.

 
 
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HIGH PERFORMANCE TEST SOCKETS

Applications

  •  Engineering test & Validation
  •  Product Characterization including RF
  •  System Level Test in PCB
  •  Volume Manufacturing with Test Handler
  •  Board to Board Interconnect
  •  Product Verification
  •  Chipset Testing & Recovery
  •  Failure Analysis
  •  Standard or Custom IC Package
  •  CSP, BGA, LGA, QFP, QFN/MLF, PGA, SOIC, SOJ, TSOP, TO, DIP, SIP, SOT
  •  -55°C to +155°C Testing
  •  0.4mm to 1.27mm Device Pitch
  •  Standard or custom matched existing PCB Footprint
  •  1 to 4 weeks lead time
  •  High Wattage or Heat Load – >80W dissipation
  •  Custom thermocouple fixture with heat sink, fan and RTD element
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BURN-IN Test Sockets

Applications

  •  Burn-In
  •  BIST & DFT
  •  -55 °C to +155°C Testing
  •  0.4mm to 1.27mm Device Pitch
  •  Standard PCB Footprint
  •  Standard or Custom IC Package
  •  CSP, BGA, LGA, QFP, QFN/MLF, PGA, SOIC, SOJ, TSOP, TO, DIP, SIP, SOT
  •  4 to 6 weeks lead time
  •  Economical Socket for High volume testing
  •  Minimum to no tooling fee
 
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Strip ContactorS

  •  Metal frame that functions as a stiffener and mount to PCB
  •  Universal footprint
  •  Replaceable cartridge