Gold Technologies Announces New Product Line

For immediate release San Jose, California, February 9, 2007, Gold Technologies, Inc. announces new B2B connector product line.

The new product, the Compliant Header Connector series, is a family of standard, fine and ultra fine pitch connectors that can be used to connect PCBs and components in systems where a high degree of reliability, high insertion count/lifespan and vertical compliance is required. Compliant Headers are available in large quantities with 2 to 50 pins and from 0.25mm (.010”) pitch to 2.54mm (0.100”) pitch.

“We’ve been asked many times for custom connectors very similar to these new products, and the market need appears to be increasing. A mobile device with 90nm or even 65nm IC’s and 0.5mm chip to board interconnects should not rely on 1960s connector technology and form factor. Using our Compliant Header products, a designer can pack as many as 50 highly reliable vertically compliant contacts into a 1mm X 10mm area.” said Bob Fenton, VP Sales & Marketing for Gold Technologies.

Added Patricia Tran, CEO of Gold Technologies: “We were able to combine robust and proven elements of our semiconductor test product lines that excel in an environment of temperature, electrical extremes and customer expectations of a million or more insertions to rapidly develop and launch this new product line.

As usual, we listened to what our customers were requesting and responded appropriately.”

The Compliant Header product is targeted for system applications such as board to board and battery connections in mobile phones and PDAs, handheld devices like scanners and analyzers and other small form factor mobile devices and will begin shipping in Q2 2007. For more information please contact Gold Technologies, Inc. at +1 (408) 321-9568 or visit www.goldtec.com.

Gold Technologies will be exhibiting the new product line at Electronics West, MD&M West in Anaheim February 13 – 15, 2007. For more information visit www.mdmwest.com.

Gold Technologies, Inc. serves the semiconductor and electronics industries as a US based designer and manufacturer of premium low cost test sockets, GoldProbes Pins (pogo pins) & custom contact elements, standard & custom connectors, SMT receptacles for through-hole to SMT conversion, Adaptor boards for footprint conversion and Interposers for connecting adaptor boards. Gold Technologies was founded in 1998 and operates facilities in San Jose, CA and Reno, NV.
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Gold Technologies Receives Patent Award

 

For immediate release
San Jose, California, January 17th, 2007 – Gold Technologies was recently awarded a patent for a new test socket hand test lid specifically targeted for high volume manufacturing, class and system test of multifunction, digital consumer and cellular devices.

US patent #7,101,209 for vertical cam lid design was awarded on August 24th, 2006.  This lid provides up to 30:1 mechanical advantage to allow fatigue free testing of moderate to large pin count devices.
“Our customers asked us for a mechanically advantaged lid that is easy to use, low cost and bulletproof.  By working closely with several customers, we were able to come up with an elegant solution that results in excellent yields and very low operator fatigue” Stated Gold Technologies Engineering Manager Sean Galligan, who is also one of the patent holders.

The lid can be removed in seconds to prepare the socket for use in an automated test handler.
“The vertical cam lid is probably the most trouble free new product introduction I have seen in almost 20 years in the test equipment industry.” Said Bob Fenton, Vice President, Sales and Marketing at Gold Technologies. “After several thousand have now shipped, we have no complaints.”

Gold Technologies, Inc. serves the semiconductor and electronics industries as a US based designer and manufacturer of premium low cost test sockets, GoldProbes Pins & custom contact elements, SMT receptacles for through-hole to SMT conversion, Adaptor boards for footprint conversion and Interposers for connecting adaptor boards. Gold Technologies was founded in 1998 and operates facilities in San Jose, CA and Reno, NV.
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Gold Technologies Announces Increases in Manufacturing Capacity & New Customer Support Plan

 

For immediate release
San Jose, California, October 12, 2006 – Gold Technologies, Inc., in response to multiple quarters of increasing sales has expanded manufacturing operations in their Nevada facility.  The new facility – scheduled to begin test socket and connector production beginning in Q4 of this year – allows immediate expansion up to 21,000 ft² and beyond if future market conditions warrant.

Patricia Tran -- Gold Technologies CEO -- described the decision process: “Even though a large percentage of our business is in Asia, expansion in a lower cost area near the Silicon Valley company headquarters offered an excellent compromise between lower costs and the travel and communications issues that often occur with Asian factory locations. Our technical and customer service personnel can travel between company headquarters and the Nevada factory in a few hours if needed, but we still expect to see outstanding cost reduction versus the same manufacturing space in San Jose.”

Instead of investing in a factory in Asia, the company has developed a program to increase the technical support available to customers in all regions.  The program is a combination of multiple day technical training seminars on demand at customer and distributor facilities as well as remote stocking of spare parts or even entire spare test sockets for certain high profile customers.

“The key here is customer response time.  Even though the semiconductor industry is up right now, customers do not tolerate long lead times from socket manufacturers for new products.  The added capacity will allow us more opportunities to serve our customers delivery needs.  The new training and support program will increase the uptime experienced by users of our products, even in relatively remote areas” Added Bob Fenton, VP of Marketing and Sales.

Gold Technologies, Inc. serves the semiconductor and electronics industries as a US based designer and manufacturer of premium low cost test sockets, GoldProbes Pins & custom contact elements, SMT receptacles for through-hole to SMT conversion, Adaptor boards for footprint conversion and Interposers for connecting adaptor boards. Gold Technologies was founded in 1998 and operates facilities in San Jose, CA and Reno, NV.
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