PRODUCT OVERVIEW
Technology Leadership
Unique and proprietary spring probe technology including state of the art machining techniques, metallurgy, plating and turn-key test socket manufacturing center combined with test application focus yields the know-how and response you need today to solve tomorrow's toughest interconnect challenges.
Test Sockets

P Series Test Socket
Any Package, Any PCB, Any Temperature
S Series Test Socket
Connecting You to the Lowest Cost of Test
D Series Test Sockets
Premium Performance at “Burn-In Socket” pricing
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Gold Probes

Barrel components made using a unique and proprietary process (patent pending), for uniform characteristics.
Proprietary Au alloy used in signal path components.
Proprietary plating & tip geometry minimizes cleaning. requirements, maximizes life and electrical characteristics.
Field proven spring selection algorithm provides ideal balance between force, CRES and lifespan.
Vertical integration and automation minimizes costs to customer for high volume applications. READ MORE ›››

Receptacles
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Interposers
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Adaptors
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Custom Connectors
We Can Design & Build What You Need!
From Design & Prototype to Validation
High Volume and Competitive Pricing for Custom Connectors vs. “Off the shelf”
Get exactly what you need, at the right price   READ MORE ›››

Product Testing

Test Methodology (full detail)

• Mechanical Dimension & Finish
• Contact Force
• Elevated Stability
• IMAX
• CRES & Durability
• Resistance vs. Pin Compression
• High Frequency Performance
• Lead free testing

Lead free testing
We have done exhaustive lifecycle testing using the following lead finish compounds:

•Pure Tin (matte tin)
•Tin-Zinc
•Tin-Gold-Copper
•Tin-Bismuth
•Tin-Silver
•Tin-Indium
•Tin-Silver-Copper
•Tin-Palladium-Gold
•Nickel-Palladium

Nickel-Palladium-Gold Based on this testing, GoldTec metallurgists have developed a special solution for lead free device testing. The material is a combination of advance machining techniques, plating alloys and hardening to achieve a low affinity coating having a hardness of approximately 800 KhN.


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recent news
01/12/2006

Gold Technologies Announces Increases in Manufacturing Capacity & New Customer Support Plan

For immediate release
San Jose, California, October 12, 2006 – Gold Technologies, Inc., in response to multiple quarters of increasing sales has expanded manufacturing operations in their Nevada facility.  The new facility – scheduled to begin test socket and connector production beginning in Q4 of this year – allows immediate expansion up to 21,000 ft² and beyond if future market conditions warrant.

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